Product Name : Flip Chip Automatic Cleaning Machine
Products

Flip Chip Automatic Cleaning Machine capability profile

  •  Tin ball solder paste helps solder flux to wash through returning and welding the stove reflow oven circuit board on Flip Chip circuit base plate.

Flip Chip Automatic Cleaning Machine specifications form

According your products requirement to manutacturing equipment

Model

UPH

(unit: mm)

Machine Size

 (unit: meter)

power consumption

(KVA)

MCB-08T

3kk pcs/month

L5.55 x W2.22 xH2.35

100

Power

AC 220V / 380V /415V  3P4W  50HZ/60HZ